The WCCML has recently acquired a Westbond 7476E wedge-wedge wire bonder which enables in-house packaging, chip-on-board, and other integrated circuit connection technologies. This ultrasonic/thermosonic bonder is designed to interconnect gold or aluminum wires ranging from 0.7 mils to 2.0 mils in diameter. The 45 degree tool angle is convertible to 90 degrees for extremely tight work spaces.

The 7476E is an advanced manual bonder which, upon sensing tool touchdown, sets the axes brakes and applies a pre-programmed force and ultrasonic energy for a programmed duration of time, among many other parameters, all of which can be independently set for each bond. The parameters for up to 21 sequential bonds can be pre-programmed and stored in one of thirty different non-volatile buffers.