The following is a list of tools available to NanoFab users. For more detailed information about the tools, follow the links on the Capabilities/Expertise pages. A summary of the standard processes is also available.

CMOS Furnace Tubes

Tempress 8-stack furnace tubes configured for: wet and dry thermal oxidation; poly-silicon, low temperature oxide and silicon nitride CVD; phosphorus and boron doping; and the annealing of 4" silicon wafers.

Lithography and Mask Making

Heidelberg DWL 66 Mask Making and Optical Direct-Write

Karl Suss MJB3 Contact Aligner

Canon 501 FA Aligner

EVG 620 Front and Backside Aligner

JEOL JBX-6000FS/E Electron Beam Lithography System

Metal Deposition

Sloan/Varian 841 Electron Beam Evaporator

Torrvac VC-320 Electron Beam Evaporator

CHA 600-SE Electron Beam Evaporator

CHA 1000-SE E-beam Evaporator

Edwards Auto306 Thermal Evaporator

MRC-8617 RF Sputter Coater

Metrology

Woollam Ellipsometer WVASE32  (www.jawoollam.com/tutorial_1.html)

Rudolph AutoEL II Ellipsometer

Dektak IIA Profilometer

Filmetrics F20

Hitachi S4700 Field Emission Scanning Electron Microscope with Energy Dispersive x-ray Analysis

Plasma Enhanced Chemical Vapor Deposition

PlasmaQuest 333 RPCVD

Rapid Thermal Annealing

Tamarack 180M

Heat Pulse 610 RTP

Jipelec

Reactive Ion Etching

STS ICP Advanced Silicon Etch (ASE)

STS ICP All General Etch (AGE)

PlasmaLab µ P80 Reactive Ion Etcher

Tegal PlasmaLine 411 Plasma Asher

Wafer Bonding

EVG620 Mask Aligner

EVG520HE Bonder and Semi-automated Hot Embossing