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Cleanroom Tools
The NanoFab cleanroom was significantly upgraded in 1998 to accommodate a 4
inch CMOS process donated by Intel and commissioned with the help of Motorola.
At the heart of our silicon process capabilities is a Tempress furnace tube
stack. Other tools include inductively coupled plasma etchers (including
a deep-Si Bosch process) and wafer bonding. The cleanroom also houses an
optical direct-write and mask making capability.
- Furnace Tubes
- Metal Deposition
- Metrology
- Optical Lithography and Mask Making
- Plasma Enhanced Chemical Vapor Deposition
- Reactive Ion Etching
- Rapid Thermal Annealing
- Wafer Aligning and Bonding
