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CSSER Facility Fees

effective July 1, 2009*

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       Internal Rates

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• New User Facility Fee - $300 (One time charge)
• Cleanroom access - $40/hr capped at $360/month
• CMOS Tubes
  • Furnace Processing - $100 per request
  • Super Critical CO2 Dryer - $15/run
• Etching
  • Plasmalab 80+ RIE (Cl) - $25/hr
  • Plasmalab 80+ RIE (F) - $25/hr
  • STS ICP Etch Tools - $40/hr
  • Xactix XeF2 Etcher - $25/hr
• Film Deposition
  • CHA #1 - $15/hr
  • Lesker #1 PVD75 Sputter - $25/hr
  • Lesker #2 PVD75 ZnO Sputter - $25/hr
  • Lesker #3 PVD75 E-beam - $25/hr
  • TorrVac - $15/hr
• High Temp Probe Station - $2/hr, 1 hr minimum
• Lithography & Mask Making
  • Electron Beam Lithography - $100/hr capped at $10,000/yr
  • EVG620 Aligner - $25/hr
  • Heidelberg DWL66 Mask Making - $30/hr
  • Karl Suss Aligner - $15/hr
• Metrology
  • FESEM - $35/hr
• Rapid Thermal Annealing
  • HeatPulse RTA - $25/hr or $10/run
  • Tamarack RTA - $25/hr or $10/run
• Wafer Bonding
  • EVG520 Embosser - $25/hr
• Tech Service

Process Technologist - $42.50/hr (plus tool charge)

*All tools subject to a minimum 1/2 hour charge

External Rates

• Cleanroom access - $1200/day (prorated hourly)
• FESEM - $350/hr
• EBL – $500/hr
• Mask Making – $250/hr**
• STS Etch Tools - $200/hr**
• EVG620 Aligner - TBD**
• EVG520 Embosser - TBD**
• RIE (Cl & F) - TBD**
• Lesker #1 PVD75 Sputterer - TBD**
• Lesker #2 PVD75 ZnO Sputter - TBD**
• Lesker #3 PVD75 E-beam - TBD**
• HeatPulse - TBD**
• Tamarack - TBD**
• Furnace Tubes - case by case basis
• Process Technologist - $100/hr (plus tool charge)

               **Does not include process tech time

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   *Prices subject to change

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